Sn plating solution
FM has been developing plating solutions and the related process techniques to improve quality issues after plating in MLCC and the other chip parts.
- surface density (coverage) and spattering during reflow
- thickness and its variation
- plating stress and crack
- reaction (etching) with glass on termination layer
- detail plating process for improving reliability and productivity
- surface density (coverage) and spattering during reflow
- thickness and its variation
- plating stress and crack
- reaction (etching) with glass on termination layer
- detail plating process for improving reliability and productivity
| (a) in ref. plating solution | (b) in FM plating solution (TSM-2) |
< Comparison of glass dissolution from Cu-terminated MLCC in (a) ref. plating solution, and (b) FM plating solution (TSM-2)