Cu Paste

: FCP-L series are Cu pastes for screen printing of inner electrode in Cu-COG (Cu-NPO) MLCC.

They are composed of small and spherical copper and ceramic powders. With FCP-L series, it is possible to make high packing density after printing and good electrode continuity after sintering.

: FCP-F and FCP-S series are Cu pastes for MLCC termination electrode and composed of fine

copper and unique glass powders. These Cu pastes can give high-density termination surface without attack from plating solution, so better MLCC reliability through hermetic sealing. They also can make good electrical contact with low capacitance variation, even at low-temp. firing such as 750℃.

	FCP-L series	FCP-F series	FCP-S series
Description	Inner paste for Cu-COG	Termination paste for big case-size	Termination paste for small case-size
Cu Metal	Spherical	Flake / Plate / Spherical
Firing Temperature*	970 ~ 1030℃	800 ~ 850℃	700 ~ 780℃
Metal Content	40 ~ 50 wt% (controllable)	65 ~ 80 wt% (controllable)
Glass / Ceramic	CaZrO3 or others	F1 / S2 / M5 glass
Viscosity	10.0 ~ 30.0 Pa·s @10 rpm	20.0 ~ 50.0 Pa·s @10 rpm
Film Density	4.5 ~ 5.5 g/cm3	3.8 ~ 5.2 g/cm3

* Firing temperature can be different according to customer’s firing conditions.